ICX039DNB.PDF datasheet pdf

Description The ICX039DNB is an interline CCD solid-state image sensor suitable for PAL color video cameras with a diagonal 8mm (Type 1/2) system. Smear, sensitivity, D-range, S/N and other characteristics have been greatly improved compared with the ICX039BNB. High sensitivity and low dark current are achieved through the adoption of Ye, Cy, Mg and G complementary color mosaic filters and HAD (Hole-Accumulation Diode) sensors. This chip features a field period readout system and an electronic shutter with variable charge-storage time. Also, this outline is miniaturized by using original package. This chip is compatible with and can replace the ICX039BNB. Features •Low smear (–20dB compared with the ICX039BNB) •High sensitivity (+3.0dB compared with the ICX039BNB) •High D range (+2.5dB compared with the ICX039BNB) •High S/N •High resolution and low dark current •Excellent antiblooming characteristics •Ye, Cy, Mg, and G complementary color mosaic filters on chip •Continuous variable-speed shutter •Substrate bias:Adjustment free (external adjustment also possible with 6 to 14V) •Reset gate pulse:5Vp-p adjustment free (drive also possible with 0 to 9V) •Horizontal register:5V drive •Maximum package dimensions:φ13.2mm Device Structure •Interline CCD image sensor •Image size:Diagonal 8mm (Type 1/2) •Number of effective pixels: 752 (H) x 582 (V) approx. 440K pixels •Total number of pixels:795 (H) x 596 (V) approx. 470K pixels •Chip size:7.95mm (H) x 6.45mm (V) •Unit cell size:8.6μm (H) x 8.3μm (V) •Optical black:Horizontal (H) direction: Front 3 pixels, rear 40 pixels Vertical (V) direction : Front 12 pixels, rear 2 pixels •Number of dummy bits:Horizontal 22 Vertical 1 (even fields only) •Substrate material:Silicon – 1 – ICX039DNB E96128C99 Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. 16 pin DIP (Ceramic) AAAAA A AAAA AAAAA AAAAA AAAAA Pin 1 V 3 40 2 12 Pin 9 H Optical black position (Top View)

Features

• •Low smear (–20dB compared with the ICX039BNB)
• •High sensitivity (+3.0dB compared with the ICX039BNB)
• •High D range (+2.5dB compared with the ICX039BNB)
• •High S/N
• •High resolution and low dark current
• •Excellent antiblooming characteristics
• •Ye, Cy, Mg, and G complementary color mosaic filters on chip
• •Continuous variable-speed shutter
• •Substrate bias:Adjustment free (external adjustment also possible with 6 to 14V)
• •Reset gate pulse:5Vp-p adjustment free (drive also possible with 0 to 9V)
• •Horizontal register:5V drive
• •Maximum package dimensions:φ13.2mm
• •Interline CCD image sensor
• •Image size:Diagonal 8mm (Type 1/2)
• •Number of effective pixels: 752 (H) x 582 (V) approx. 440K pixels
• •Total number of pixels:795 (H) x 596 (V) approx. 470K pixels
• •Chip size:7.95mm (H) x 6.45mm (V)
• •Unit cell size:8.6μm (H) x 8.3μm (V)
• •Optical black:Horizontal (H) direction: Front 3 pixels, rear 40 pixels
• •Number of dummy bits:Horizontal 22
• •Substrate material:Silicon