Surface mount transient voltage suppressor power 200 watts
FEATURES
• For surface mounted applications in order to
optimize board space.
• Low profile package
• Glass passivated junction
• Low inductance
• Plastic package has Underwriters Laboratory
Flammability
MECHANICAL DATA
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, Method 2026
• A 27mg 0.00095ozpprox. Weight:
PINNING
PIN
1
2
DESCRIPTION
Cathode
Anode
Maximum Ratings and Electrical characteristics
Ratings at 25 ambient temperature unless otherwise specified. °C
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above T = 25 per Fig. 2.
A
2. Mounted on FR-4 PCB single-sided copper, mini pad.
3. Peak Forward Surge Current : 8.3ms single half sine-wave Superimposed on rated load (JEDEC method).
4. Peak pulse power waveform is 10/1000μS.
°C
SMAF5.0A
Features
- • For surface mounted applications in order to
- • Low profile package
- • Glass passivated junction
- • Low inductance
- • Plastic package has Underwriters Laboratory
- • Case: SMAF
- • Terminals: Solderable per MIL-STD-750, Method 2026
- • A 27mg 0.00095ozpprox. Weight:
- 1. Non-repetitive current pulse, per Fig.3 and derated above T = 25 per Fig. 2.
- 2. Mounted on FR-4 PCB single-sided copper, mini pad.
- 3. Peak Forward Surge Current : 8.3ms single half sine-wave Superimposed on rated load (JEDEC method).
- 4. Peak pulse power waveform is 10/1000μS.
Specifications
THRU SMAF220A
Parameter
Peak Pulse Power Dissipation on 10/1000us waveform
Typical Junction capacitance at VR=4V, f=1MHz
Symbol
Value
Unit
P
PPM
Min200
W
390
C
J
Peak Forward Surge Current (Note 2,Fig 4)
I
FSM
20
A
Peak Pulse Current on 10/1000 us waveform (Note 1, Fig 2)
I
PPM
see Table 1
ESD Voltage per IEC6100-4-2
Contact
Air
Typical Thermal Resistance Junction to Ambient(Note 2)
Operating Junction Temperature and Storage Temperature Range
V
ESD1
V
ESD2
R
θJA
T, T
j
stg
8
15
150
°C
-55 ~ +150
°C/W
A
kV
pF
Simplified outline SMAF and symbol
Unipolar
Bipolar
1
2
http://www.trr-jx.com
version: 02