BGA425 datasheet pdf

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BGA425 datasheet pdf

Datasheet Information

Pages: 8

BGA 425 Semiconductor Group Jul-14-19981 Si-MMIC-Amplifier in SIEGET  25-Technologie VPS05605 4 2 1 3 Preliminary data • Multifunctional casc. 50 Ω block (LNA / MIX) • Unconditionally stable • Gain | S 21 | 2 = 18.5 dB at 1.8 GHz (appl.1) gain | S 21 | 2 = 22 dB at 1.8 GHz (appl.2)

Specifications
IP 3out = +7 dBm at 1.8 GHz (V D =3V,I D =9.5mA) • Noise figure NF = 2.2 dB at 1.8 GHz • Reverse isolation >28 dB (appl.1) >35 dB (appl.2) • typical device voltage V D = 2 V to 5 V Tape loading orientation Circuit Diagram EHA07371 V 2, 5 4 IN OUTA + 3 6 OUTB 1 GND ESD: Electrostatic discharge sensitive device, observe handling precaution! PIN Configuration TypeMarkingOrdering Code1, Out B3, Out A2, GNDPackage BGA 4254, IN5, GND6, +VBMsQ62702-G0058SOT-343 Maximum Ratings Parameter SymbolValueUnit Device current I D 25mA Device voltage V D ,+V V6 Total power dissipation, T S ≤ tbd °CP tot 150mW R F input powerP RFin -10dBm Junction temperature T j 150°C Ambient temperature T A -65 ...+150 Storage temperature T stg -65 ...+150 Thermal Resistance Junction - soldering point 1) R thJS ≤ tbd K/W 1) T S is measured on the ground lead at the soldering point to the pcb Semiconductor Group11998-11-01