BC850 (2) datasheet pdf

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Oct 22, 2025, 03:25 PM

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BC850 (2) datasheet pdf

Datasheet Information

Pages: 2

BC846 ... BC850 BC846 ... BC850 SMD General Purpose NPN Transistors SMD Universal-NPN-Transistoren I C = 100 mA h FE = 180/290/520 T jmax = 150°C V CEO = 30...65 V P tot = 250 mW Version 2015-10-30 ~ SOT-23 (TO-236) 1 = B 2 = E 3 = C Dimensions - Maße [mm] Typical Applications Signal processing, Switching, Amplification Commercial grade 1 Typische Anwendungen Signalverarbeitung, Schalten, VerstĂ€rken StandardausfĂŒhrung 1 ) Features General Purpose Three current gain groups Compliant to RoHS, REACH, Conflict Minerals 1 ) Besonderheiten Universell anwendbar Drei StromverstĂ€rkungsklassen Konform zu RoHS, REACH, Konfliktmineralien 1 Mechanical Data 1 )Mechanische Daten 1 ) Taped and reeled3000 / 7“Gegurtet auf Rolle Weight approx.0.01 gGewicht ca. Case materialUL 94V-0GehĂ€usematerial Solder & assembly conditions260°C/10sLöt- und Einbaubedingungen MSL = 1 Maximum ratings (T A = 25°C)Grenzwerte

Specifications
(T A = 25°C) BC846BC847BC850 BC848 BC849 Collector-Emitter-volt. – Kollektor-Emitter-SpannungB openV CEO 65 V45 V45 V30 V Collector-Base-voltage – Kollektor-Basis-SpannungE openV CBO 80 V50 V50 V30 V Emitter-Base-voltage – Emitter-Basis-SpannungC openV EBO 6 V5 V Power dissipation – VerlustleistungP tot 250 mW 2 ) Collector current – Kollektorstrom (dc)I C 100 mA Peak Collector current – Kollektor-SpitzenstromI CM 200 mA Junction temperature – Sperrschichttemperatur Storage temperature – Lagerungstemperatur T j T S -55...+150°C -55...+150°C Characteristics (T j = 25°C)Kennwerte (T j = 25°C) Min.Typ.Max. DC current gain – Kollektor-Basis-StromverhĂ€ltnis V CE = 5 V, I C = 10 ÎŒAGroup A Group B Group C h FE h FE h FE – – – 90 150 270 – – – V CE = 5 V, I C = 2 mAGroup A Group B Group C h FE h FE h FE 110 200 420 180 290 520 220 450 800 1Please note the detailed information on our website or at the beginning of the data book Bitte beachten Sie die detaillierten Hinweise auf unserer Internetseite bzw. am Anfang des Datenbuches 2Mounted on P.C. board with 3 mm 2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm 2 Kupferbelag (Lötpad) an jedem Anschluss © Diotec Semiconductor AGhttp://www.diotec.com/1 Pb E L V W E E E R o H S 2 . 4 1 . 3 ± 0 . 1 1.1 +0.1 0.4 +0.1 2.9 ±0.1 1 2 3 Type Code 1.9 ±0.1 -0.05 -0.2 ± 0 . 2

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