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NXP Semiconductors Data Sheet: Technical Data Document Number: IMX6SXIEC Rev. 4, 11/2018 Package Information Plastic Package BGA 19 x 19 mm, 0.8 mm pitch BGA 17 x 17 mm, 0.8 mm pitch BGA 14 x 14 mm, 0.65 mm pitch Ordering Information See Table 1 on page 3 MCIMX6XxCxxxxxB MCIMX6XxCxxxxxC NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products 1Introduction The i.MX 6SoloX processors represent NXP Semiconductor's latest achievement in integrated multimedia-focused products offering high-performance processing with a high degree of functional integration to meet the demands of high-end, advanced industrial and medical applications requiring graphically rich and highly responsive user interfaces. The i.MX 6SoloX processor features NXP’s advanced implementation of the single Arm ® Cortex ® -A9 core, which operates at speeds of up to 800 MHz, in addition to the Arm Cortex-M4 core, which operates at speeds of up to 227 MHz. This type of heterogeneous multicore architecture provides greater levels of system integration, smart low-power system awareness, and fast real-time responsiveness. The i.MX 6SoloX includes a GPU processor capable of supporting 2D and 3D operations, a wide range of display and connectivity options, and integrated power management. Each processor provides a 32-bit DDR3/DDR3L/LPDDR2-800 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera sensors. i.MX 6SoloX Applications Processors for Industrial Products 1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1Special Signal Considerations. . . . . . . . . . . . . . . . 18 3.2Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 4.2Power Supplies Requirements and Restrictions . . 32 4.3Integrated LDO Voltage Regulator Parameters . . 33 4.4PLL Electrical Characteristics . . . . . . . . . . . . . . . . 35 4.5On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 36 4.6I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 4.7I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 42 4.8Output Buffer Impedance Parameters. . . . . . . . . . 45 4.9System Modules Timing . . . . . . . . . . . . . . . . . . . . 48 4.10 Multi-mode DDR Controller (MMDC). . . . . . . . . . . 60 4.11 General-Purpose Media Interface (GPMI) Timing. 61 4.12 External Peripheral Interface Parameters . . . . . . . 69 4.13 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 5Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 116 5.1Boot Mode Configuration Pins. . . . . . . . . . . . . . . 116 5.2Boot Device Interface Allocation . . . . . . . . . . . . . 118 6Package Information and Contact Assignments . . . . . . 126 6.1i.MX 6SoloX Signal Availability by Package . . . . 126 6.2Signals with Different States During Reset and After Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 6.319x19 mm Package Information . . . . . . . . . . . . . 129 6.417x17 mm Package Information . . . . . . . . . . . . . 148 6.514x14 mm Package Information . . . . . . . . . . . . . 183 7Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199